WE ARE MATULKA

At Matulka electronic GmbH, we strive to be a leader in the field of electronics manufacturing by providing innovative solutions and the highest quality standards. Our mission is to provide our customers with first-class services in the areas of SMT assembly, THT assembly, device assembly, cable assembly, control cabinet construction, testing & inspection, X-ray, painting & potting and material management.

Through continuous process optimization, state-of-the-art technologies and dedicated employees, we aim not only to meet our customers’ expectations, but to exceed them.

We focus on sustainable growth and attach great importance to the further development of our employees and future-oriented investments in our production facilities. Our aim is to build long-term partnerships and to be recognized as a reliable partner for high-quality electronics solutions in the industry.

Experience in electronics production: 50 years
Successfully completed projects annually: 700+
satisfied customers: 100+

1970

Foundation of Habelt Elektronik in Nördlingen and start of THT assembly.

With the start of THT assembly, we laid the foundation for high-quality solutions that are optimally tailored to the requirements of our customers.

1980

Takeover of Habelt Elektronic by the Schunk Group

Habelt Elektronik was taken over by the Schunk Group and renamed Schunk-Elektronik GmbH. This takeover enables the company to further strengthen its market position and develop innovative solutions and technologies even more effectively.

1986

Introduction of SMT assembly (Surface Mounted Technology).

With the introduction of SMT (Surface Mounted Technology) assembly, we are expanding our service portfolio and significantly improving precision and efficiency in production.

1989

Change of name to Matulka elektronic GmbH.

The change of name to Matulka electronic GmbH marked an important step in our company’s development. At the same time, we received our first DIN EN ISO 9000 certification, which documents our commitment to the highest quality standards and continuous process optimization.

1998

Expansion of the ICT/FCT test and inspection facilities.

Expansion of the ICT/FCT testing and inspection facilities, resulting in more comprehensive quality control and greater product reliability.

1999

Installation of AOI systems (Automated Optical Inspection)

Installation of AOI systems (Automated Optical Inspection) to increase precision and efficiency in production monitoring.

2000

Move to the new company building in the Anton-Jaumann-Industriepark.

Relocation to the new company building in the Anton-Jaumann-Industriepark in Nördlingen. The modern production facilities made it possible to expand capacities and optimize processes.

2003

Introduction of BGA technology (Ball Grid Array)

Introduction of BGA technology (Ball Grid Array), which enables the assembly of more complex components.

2004

Expansion of the operating area by 900 m2

Expansion of the production area by 900^{m2 to}3600^{m2, which}led to a significant increase in production capacity and the integration of new technologies.

2006

Conversion to RoHS-compliant production

Conversion to RoHS-compliant production to meet the latest environmental and safety standards.

2007

Introduction of the selective soldering process

Thanks to the selective soldering process, we have not only significantly increased soldering quality, but also optimized process efficiency. This precise technology enables us to produce targeted and reliable soldered connections, resulting in higher production quality and shorter production times.

2010

Introduction of laser marking

With the help of laser marking, we have been able to optimize product marking and make traceability much easier. This technology enables us to better track quality assurance and traceability throughout the entire production chain.

2011

Expansion of the AOI systems to include oblique view technology

Thanks to the new angled view technology in our AOI systems, we are able to significantly optimize inspection processes. By inspecting from different angles, we can detect defects even more precisely and thus ensure the highest quality for components and PCBs.

2011 – 2013

Expansion of the machine park with state-of-the-art systems

Expansion of the machine park with state-of-the-art equipment, including a modular hydropneumatic press system, a semi-automatic depaneling machine, a stirrup soldering system, state-of-the-art placement machines, a CHP unit and an absorption refrigeration system, to increase production capacities and sustainable manufacturing.

2013

Expansion of mechanics with CNC milling machines

Expansion of the mechanics with CNC milling machines, CNC lathes and various saws to increase production flexibility and efficiency.

2014

Installation of a photovoltaic system

Installation of a photovoltaic system to promote sustainable energy generation and reduce the ecological footprint.

2014 / 2015

Modernization of the reflow system

By modernizing our reflow system, we are significantly increasing both the efficiency and quality of the soldering processes. The new technology enables more precise temperature control and optimized time profiles, resulting in deeper solder joints and a significantly reduced error rate.

2015

Purchase of a new Flying Prober

Thanks to the acquisition of a new flying prober, we have been able to considerably shorten throughput times and significantly improve our test processes. This state-of-the-art testing technology enables efficient and precise inspection of printed circuit boards, which leads to faster results and higher product quality.

2017

Expansion of the service portfolio to include conformal coating

Expansion of the service portfolio to include conformal coating by installing an automatic painting machine and manual painting workstations to increase the protection and durability of the assemblies.

2021

Commissioning of an X-Ray system.

Thanks to the commissioning of our new X-Ray system, we have made significant progress in the quality assurance of our products. By precisely analyzing the internal structures of printed circuit boards and components, we ensure that the highest quality standards are met.

2021

Commissioning of an additional selective soldering system

With the commissioning of our additional selective soldering system, we are expanding our production capacities and optimizing our soldering processes.

2022

Commissioning of a new wave soldering system.

Our new wave soldering system ensures efficient soldering processes and guarantees the highest quality. During wave soldering, all solder joints are connected simultaneously and reliably.

2024